DocumentCode
2739303
Title
Substrate Approach for the Symphony Of IC & Packaging
Author
Ho, V.P.J.
fYear
2008
fDate
22-24 Oct. 2008
Firstpage
156
Lastpage
158
Abstract
In this paper, there will be detail discussed to let reader understand the trend of IC & substrate & packaging technology and how to react with each others such as symphony.
Keywords
integrated circuit packaging; IC; integrated circuit technology; packaging technology; substrate approach; symphony; Bonding; Consumer electronics; Electronics packaging; Flip chip; Integrated circuit packaging; Manufacturing; Product design; Space technology; Through-silicon vias; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. 3rd International
Conference_Location
Taipei
Print_ISBN
978-1-4244-3623-1
Electronic_ISBN
978-1-4244-3624-8
Type
conf
DOI
10.1109/IMPACT.2008.4783831
Filename
4783831
Link To Document