DocumentCode
2739474
Title
Photoplastic NEMS with an Encapsulated Polysilicon Piezoresistor
Author
Kale, Nitin S. ; Nag, Sudip ; Pinto, R. ; Rao, Ramgopal V.
Author_Institution
Centre for Nanoelectron., IIT Bombay, Mumbai
fYear
2008
fDate
18-21 Aug. 2008
Firstpage
460
Lastpage
463
Abstract
We demonstrate a photoplastic NEMS device that has an encapsulated polysilicon piezoresistor. The crucial temperature limitation of depositing a polysilicon film on a polymer was overcome by employing a novel Hotwire CVD process. In this paper, we report the fabrication and characterization of a novel polymeric cantilever with an embedded piezoresistor, which exploits the low Youngs modulus of a polymer and high gauge factor of polysilicon. Such devices are widely used for sensing biochemicals.
Keywords
cantilevers; nanotechnology; piezoresistive devices; resistors; chemical vapour deposition; embedded piezoresistor; encapsulated polysilicon piezoresistor; hotwire CVD process; low Youngs modulus; photoplastic NEMS device; polymeric cantilever; polysilicon film; Biomedical optical imaging; Electrical resistance measurement; Fabrication; Nanoelectromechanical systems; Optical refraction; Optical sensors; Optical variables control; Piezoresistance; Plasma temperature; Polymers;
fLanguage
English
Publisher
ieee
Conference_Titel
Nanotechnology, 2008. NANO '08. 8th IEEE Conference on
Conference_Location
Arlington, TX
Print_ISBN
978-1-4244-2103-9
Electronic_ISBN
978-1-4244-2104-6
Type
conf
DOI
10.1109/NANO.2008.140
Filename
4617122
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