The composition of intermetallic compounds in Sn-Ag-Bi-In solders on Cu substrates

Author

Chen, M.H. ; Jieng, Y.Y. ; Wu, Albert T.

Author_Institution

Inst. of Mater. Sci. & Eng., Nat. Taipei Univ. of Technol., Taipei

fYear

2008

fDate

22-24 Oct. 2008

Firstpage

209

Lastpage

211

Abstract

84Sn-3Ag-3Bi-10In and 89Sn-3Ag-3Bi-5In solders were subjected to reflow and solid state aging. The intermetallic compounds that formed at the interfaces between the solders and the Cu substrates and those that formed in the bulk solders in both test conditions were investigated. In the as-reflow samples, the intermetallic compounds were identified as Cu₃Sn and Cu₆Sn₅. After solid state aging, these compounds became Cu₆(Sn,In)₅ and Cu₃(Sn,In). The compounds that formed in the bulk solders were zeta phase, the solid solution of Ag₃Sn and Ag₂In.

Keywords

ageing; bismuth alloys; copper; indium alloys; reflow soldering; silver alloys; solders; solid solutions; tin alloys; Cu; Cu₃(SnIn); Cu₆(SnIn)₅; SnAgBiIn-Cu; bulk solders; interfacial IMCs; intermetallic compounds; reflow process; solid solution; solid state aging; Aging; Bismuth; Cities and towns; Environmentally friendly manufacturing techniques; Intermetallic; Lead; Materials science and technology; Mechanical factors; Solid state circuits; Tin;

fLanguage

English

Publisher

ieee

Conference_Titel

Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. 3rd International

Conference_Location

Taipei

Print_ISBN

978-1-4244-3623-1

Electronic_ISBN

978-1-4244-3624-8

Type

conf

DOI

10.1109/IMPACT.2008.4783846

Filename

4783846