DuPont Fluorochemical materials in TSV process

As a result of Montreal Protocol, CFCs included Freon TES and Genesolv DES in electronic assemblies cleaning as well as de-flux solvent for Surface Mounting Technology, SMT, in PCB industry has been banned for production. DuPont fluorochemical came up with the effective alternative, Vertrel^reg, with zero ODP (Ozone Depletion Potential) as special fluids for cleaning and which also is proven as an effective fluorinated polymer remover in Through Silicon Via, TSV, process required of the advance package industry. Beyond the solution of polymer remover, DuPont Fluorochemical also introduces the cost effective Zyron^reg C₄F₈ in the Deep Reactive Ion Etching, DRIE, process of the TSV required.