DocumentCode :
2739944
Title :
Influence of Surface Stress on Bending Nanowires with Different Boundary Conditions
Author :
He, Jin ; Lilley, Carmen M.
Author_Institution :
Dept. of Mech. & Ind. Eng., Illinois Univ., Chicago, IL
fYear :
2008
fDate :
18-21 Aug. 2008
Firstpage :
565
Lastpage :
568
Abstract :
The influence of surface stress on the static and dynamic bending nanowires is investigated by incorporating the Young-Laplace equation into Euler-Bernoulli beam theory. The proposed theoretical approach gives explicit solutions for bending nanowires with two different boundary conditions - cantilever, and fixed-fixed. The solutions indicate that the nanowires behave as softer material for the cantilever structure and stiffer material for the fixed-fixed structure as the nanowire diameter decreases for a positive surface stress and a constant length. The surface stress influenced nanowire bending behavior is not only diameter dependent but also length dependent. Based on the proposed approach, nanowire overall Young´s modulus is calculated to exhibit the nanowire elastic bending behavior influenced by the surface stress. The theoretical calculations of the overall Young´s moduli agree with reported experiment results of Ag nanowires with diameter in the range of 38.7~135 nm and length in the range of 1-2.55 mum.
Keywords :
Young´s modulus; bending; nanowires; silver; stress-strain relations; Ag; Euler-Bernoulli beam theory; Young´s modulus; Young-Laplace equation; cantilever boundary condition; elastic bending; fixed-fixed boundary condition; nanowires; surface stress; Actuators; Boundary conditions; Differential equations; Helium; Industrial engineering; Mechanical systems; Nanoelectromechanical systems; Nanowires; Stress; Testing;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nanotechnology, 2008. NANO '08. 8th IEEE Conference on
Conference_Location :
Arlington, TX
Print_ISBN :
978-1-4244-2103-9
Electronic_ISBN :
978-1-4244-2104-6
Type :
conf
DOI :
10.1109/NANO.2008.167
Filename :
4617149
Link To Document :
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