Title :
Lighting Up Your Green Thought -Novel Research in Halogen Free Material Application
Author :
Yeh, Tzuoo-Lun ; Chen, Albert ; Huang, Richard
Author_Institution :
Taiwan Union Technol. Corp, Chupei
Abstract :
Over these years, market trend and government regulation have lead to the introduction of halogen free material. As CCL supplier, we consider that the benefit of halogen free resin not only for environmental consideration but also enhance some particular characteristics for specific PCB application. We have developed a novel halogen free material. Except excellent thermal performance, we also develop some additional characteristic in this halogen free material, including lower and stabilized dissipation factor, better material thermal conductivity, higher flexural modulus and hardness. In this research, we demonstrate the electrical, mechanical, and thermal experiment to verify those unique benefits that new halogen free material has. In our experiment results, this new halogen free material performs a lower signal loss. It also has wider application for high frequency transmission to act as an alternative selection of lower loss base material. Also the hardness and thermal resistance of the new halogen free material still perform well in extremely high temperature environment. It can improve some process difficulties in thinner laminate or CSP application. In this environmental consideration moment, halogen free materials are not merely a slogan of "Halogen Free" but also need to observe where and what a comprehensive function besides present thinking modes.
Keywords :
bending; dielectric losses; electrical resistivity; flame retardants; hardness; permittivity; polymers; thermal conductivity; CCL supplier; PCB raw material; extremely high temperature environment; flexural modulus; halogen free material application; halogen free resin; hardness; thermal conductivity; thermal resistance; Conducting materials; Frequency; Government; Laminates; Propagation losses; Resins; Temperature; Thermal conductivity; Thermal factors; Thermal resistance;
Conference_Titel :
Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. 3rd International
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-3623-1
Electronic_ISBN :
978-1-4244-3624-8
DOI :
10.1109/IMPACT.2008.4783879