Development of Halogen-Free and Phosphorous-Free Dielectric Material for Highly Thermal Conductivity Copper Clad Laminate

A newly developed reactive polyimide oligomer has been developed for the modification of BMI resin. The new modified-BMI dielectrics exhibit excellent toughness and high thermal stability and can pass the UL-94 V0 flame retarding standard without the use of halogen or phosphorous flame retardant. Copper clad laminate from these new modified BMI dielectric shows super high T_g (T_g > 270 degC), good mechanical and thermal properties, is compatible with traditional FR-4 processing conditions, and the newly-developed CCL has lower cost than traditional BMI materials. Moreover, these modified-BMI dielectrics hybridize inorganic fillers with higher thermal conductivity to form new high thermal conductivity materials.