• DocumentCode
    2740250
  • Title

    High Performance Base Materials Made by Powder Coating Technology

  • Author

    Hunziker, Max ; Horst, Gerhard

  • Author_Institution
    Atotech Germany GmbH
  • fYear
    2008
  • fDate
    22-24 Oct. 2008
  • Firstpage
    344
  • Lastpage
    347
  • Abstract
    VIALAMreg Series, manufactured by Atotech\´s Advanced Epoxy Powder Technology are high performance build-up materials for HDI and IC Packaging industries. The manufacturing technology exclusively employs dry powder formulations without the need for costly and environmentally impacting organic solvents. In addition it allows for a greater manufacturing and formulation flexibility in creating dielectric resins of precise electrical, physical and mechanical properties better attuned to the needs of electronics designers and PWB manufacturers Atotech\´s process, in contrast to the conventional liquid coating process, utilizes an extruded dielectric resin, which is milled and then applied onto the foil, with the resin always in a dry powder form. The foil then passes through a melting step that converts the dry powder into a "B" staged homogeneous coating fully ready for use at the customer. In addition Atotech has developed the technology to reinforce the coated foil with woven glass fabrics to fulfill the market needs for ultra thin reinforced substrates with low CTE (coefficient of thermal expansion) values and highest reliability. The paper will address material properties achieved through this innovative manufacturing technology.
  • Keywords
    integrated circuits; manufacturing processes; packaging; powder technology; printed circuits; resins; Atotech´s Advanced Epoxy Powder Technology; HDI Packaging industries; IC Packaging industries; PWB manufacturers; VIALAMreg Series; buildup materials; dielectric resins; manufacturing technology; organic solvents; powder coating technology; Coatings; Dielectric liquids; Dielectric materials; Integrated circuit packaging; Manufacturing industries; Manufacturing processes; Mechanical factors; Powders; Resins; Solvents;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. 3rd International
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-3623-1
  • Electronic_ISBN
    978-1-4244-3624-8
  • Type

    conf

  • DOI
    10.1109/IMPACT.2008.4783882
  • Filename
    4783882