• DocumentCode
    2740273
  • Title

    Variability in measured SEE sensitivity associated with design and fabrication iterations

  • Author

    Koga, R. ; Crain, S. ; George, J. ; LaLumondiere, S. ; Crawford, K. ; Yu, P. ; Tran, V.

  • Author_Institution
    Aerosp. Corp., El Segundo, CA, USA
  • fYear
    2003
  • fDate
    21-25 July 2003
  • Firstpage
    77
  • Lastpage
    82
  • Abstract
    SEE sensitivity variabilities emerge in microcircuit design iterations and fabrication changes. They encompass various types of SEE. While some SEE sensitivity variabilities remain acceptable, others are not tolerated for space applications.
  • Keywords
    DRAM chips; flash memories; integrated circuit manufacture; radiation effects; SEE sensitivity variability; die shrinkage; dynamic random access memory; linear energy transfer; microcircuit design iterations; microcircuit fabrication iterations; single event effects; single event latchup; space applications; Automatic testing; Computer errors; Cyclotrons; Decoding; Fabrication; Manufacturing; Object recognition; Particle beams; Random access memory; Single event upset;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Radiation Effects Data Workshop, 2003. IEEE
  • Print_ISBN
    0-7803-8127-0
  • Type

    conf

  • DOI
    10.1109/REDW.2003.1281348
  • Filename
    1281348
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2740273