DocumentCode
2740312
Title
Birefringence Simulation of Annealed Ingot of Magnesium Fluoride Single Crystal
Author
Kitamura, Yoshifumi ; Miyazaki, N. ; Mabuchi, T. ; Nawata, T.
Author_Institution
Dept. of Mech. Eng. & Sci., Kyoto Univ., Kyoto
fYear
2008
fDate
22-24 Oct. 2008
Firstpage
356
Lastpage
359
Abstract
We developed a method for simulating birefringence of an annealed ingot of MgF2 single crystal for lithography optics. This method provides the optical path difference caused by crystal symmetry and residual stress existing in the crystal. The method consists of the residual stress analysis and the birefringence analysis. The residual stres analysis comprises the heat conduction analysis and the elastic thermal stress analysis. The heat conduction analysis provides the temperature distribution during ingot annealing and the elastic thermal stress analysis provides the residual stress after annealing by using the result of the heat conduction analysis. Because there exists no experimental data on the inelastic behavior of MgF2 single crystal, the residual stress was estimated with the elastic thermal stress analysis by assuming a stress-free temperature, by which the inelastic behavior could be treated approximately. The finite element method was applied to both the heat conduction analysis and the elastic thermal stress analysis. In these analyses, the temperature dependence of material properties and the crystal anisotropy were taken into account. In the birefringence analysis, the distributions of optical path difference were calculated by an approximate method using the result of the residual stress analysis. This approximate method uses the average stress along the wave normal and is equivalent to the exact method in case of low stress dealt with the present study. In this analysis, it is possible to consider both the intrinsic birefringence and the stress birefringence in any crystal orientation.
Keywords
annealing; crystal orientation; crystal symmetry; elasticity; finite element analysis; heat conduction; ingots; internal stresses; magnesium compounds; mechanical birefringence; optical materials; thermal stresses; MgF2; annealed ingot; crystal anisotropy; crystal orientation; crystal symmetry; elastic thermal stress analysis; finite element method; heat conduction analysis; inelastic behavior; lithography optics; magnesium fluoride single crystal; residual stress; stress birefringence simulation; Birefringence; Finite element methods; Lithography; Magnesium compounds; Residual stresses; Simulated annealing; Temperature dependence; Temperature distribution; Thermal conductivity; Thermal stresses;
fLanguage
English
Publisher
ieee
Conference_Titel
Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. 3rd International
Conference_Location
Taipei
Print_ISBN
978-1-4244-3623-1
Electronic_ISBN
978-1-4244-3624-8
Type
conf
DOI
10.1109/IMPACT.2008.4783885
Filename
4783885
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