مرکز منطقه ای اطلاع رساني علوم و فناوري

DocumentCode :

2740669

Title :

[Front cover]

fYear :

2008

fDate :

22-24 Oct. 2008

Abstract :

Presents the front cover or splash screen of the proceedings.

fLanguage :

English

Publisher :

ieee

Conference_Titel :

Microsystems, Packaging, Assembly & Circuits Technology Conference, 2008. IMPACT 2008. 3rd International

Conference_Location :

Taipei

Print_ISBN :

978-1-4244-3623-1

Type :

conf

DOI :

10.1109/IMPACT.2008.4783904

Filename :

4783904

Link To Document :