Title :
An SOI floating body charge monitor technique
Author :
Saccamango, M.J. ; Kuang, J.B. ; Hsu, L.L. ; Ratanaphanyarat, S.
Author_Institution :
Enterprise Syst. Group, IBM Corp., Hopewell Junction, NY, USA
Abstract :
SOI pass transistor circuits are vulnerable to initial-cycle parasitic bipolar current which can cause speed degradation or functional failures (Kuang et al, 1997; Lu et al, 1997). This paper describes a novel floating body charge monitoring method which effectively reduces the sensitivity of transient response in the initial cycles and improves circuit robustness and noise margin without using body-contacted devices. In doing so, we avoid the area penalty, issues of contact resistance, and modeling difficulties associated with body contacts. The charge monitor mimics the circuit configuration and biasing characteristics of a particular circuit, such as the MUX topology, which is prone to bipolar current-induced initial-cycle slowdown. When excess body charge is detected by the monitor circuit, an additional discharge path is automatically enabled to provide more switching current and thus minimize timing variation
Keywords :
MOS integrated circuits; electric current; integrated circuit measurement; integrated circuit noise; monitoring; network topology; silicon-on-insulator; timing; transient response; MUX topology; SOI floating body charge monitor technique; SOI pass transistor circuits; Si-SiO2; area penalty; biasing characteristics; bipolar current-induced initial-cycle slowdown; body contacts; body-contacted devices; charge monitor; circuit configuration; circuit robustness; contact resistance; discharge path; excess body charge detection; floating body charge monitoring method; functional failures; initial-cycle parasitic bipolar current; modeling; monitor circuit; noise margin; sensitivity; speed degradation; switching current; timing variation minimization; transient response; Bipolar transistor circuits; Circuit noise; Circuit topology; Computerized monitoring; Condition monitoring; Contact resistance; Degradation; Noise reduction; Noise robustness; Transient response;
Conference_Titel :
SOI Conference, 2000 IEEE International
Conference_Location :
Wakefield, MA
Print_ISBN :
0-7803-6389-2
DOI :
10.1109/SOI.2000.892783