• DocumentCode
    2741396
  • Title

    A 1-V, 1.9-GHz CDMA, CMOS on SOI, low noise amplifier

  • Author

    Jin, Heng ; Salama, C. Andre T

  • Author_Institution
    Dept. of Electr. & Comput. Eng., Toronto Univ., Ont., Canada
  • fYear
    2000
  • fDate
    2000
  • Firstpage
    102
  • Lastpage
    103
  • Abstract
    The analog front-end in a wireless transceiver acts as the interface between the antenna and the digital signal processor. In the digital signal processor, low power is essential, making submicron CMOS technology the best implementation choice. The analog front-end and specifically the low noise amplifier (LNA) require a high speed technology, such as GaAs or silicon bipolar. However, the use of low-cost submicron CMOS or SOI CMOS technology in the analog front-end may lead to an optimum single chip implementation of both the analog and digital building blocks in wireless transceivers used in modern high capacity mobile communication systems. Such an implementation offers reduced cost and improved reliability. This paper describes a 1 V, 0.5 μm SOI CMOS LNA optimized for CDMA applications and operating in the 1.93-1.99 GHz band. Compared to previously reported designs (Johnson et al., 1998; Komurasaki et al., 1998; Jin et al., 1999; Harada et al., 2000), this design offers lower noise, high gain, low intermodulation distortion and on-chip 50 Ω input output impedance matching
  • Keywords
    CMOS integrated circuits; UHF amplifiers; circuit optimisation; code division multiple access; impedance matching; integrated circuit design; integrated circuit measurement; integrated circuit noise; intermodulation distortion; mixed analogue-digital integrated circuits; mobile radio; silicon-on-insulator; transceivers; 0.5 micron; 1 V; 1.9 GHz; 1.93 to 1.99 GHz; 50 ohm; CDMA; CDMA applications; CMOS technology; CMOS-SOI low noise amplifier; DSP power; LNA; SOI CMOS LNA; SOI CMOS technology; Si-SiO2; analog front-end; analog/digital building blocks; antenna-DSP interface; digital signal processor; gain; implementation cost; intermodulation distortion; low noise amplifier; mobile communication systems; noise; on-chip input output impedance matching; optimum single chip implementation; reliability; wireless transceiver; wireless transceivers; CMOS process; CMOS technology; Costs; Digital signal processors; Gallium arsenide; Low-noise amplifiers; Mobile communication; Multiaccess communication; Silicon; Transceivers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOI Conference, 2000 IEEE International
  • Conference_Location
    Wakefield, MA
  • ISSN
    1078-621X
  • Print_ISBN
    0-7803-6389-2
  • Type

    conf

  • DOI
    10.1109/SOI.2000.892790
  • Filename
    892790