DocumentCode :
2741415
Title :
A 1 V, 1.9 GHz, low distortion dual-gate CMOS on SOI mixer
Author :
Ye, Song ; Salama, C.A.T.
Author_Institution :
Dept. of Electr. & Comput. Eng., Toronto Univ., Ont., Canada
fYear :
2000
fDate :
2000
Firstpage :
104
Lastpage :
105
Abstract :
The front-end of a typical wireless receiver operating in the 1-2 GHz range uses silicon bipolar or GaAs processes. Although these processes provide good performance, they result in large area circuits, dissipate high power and are not amenable to implementation on the same chip as the remaining CMOS digital baseband circuitry. To overcome these disadvantages, RF front-ends must be implemented in CMOS technology to achieve low cost, small area and minimum power dissipation. CMOS on SOI is particularly suitable for the cointegration of RF and digital CMOS circuits because of low substrate parasitics and minimum coupling which result in high performance active and passive (inductors, capacitors) elements, making it an ideal technology for RF front-ends and specifically mixer implementations. This paper presents a 1 V, 0.5 μm CMOS on SOI dual-gate mixer with a RF input of 1.93 GHz and an IF output of 210 MHz. Compared to recently reported mixers (Sullivan et al., 1999), this design has higher conversion gain, lower NF, 50 Ω on-chip RF matching, excellent IIP3 and low power dissipation
Keywords :
CMOS integrated circuits; UHF integrated circuits; UHF mixers; capacitors; electric distortion; impedance matching; inductors; integrated circuit measurement; integrated circuit noise; mixed analogue-digital integrated circuits; mobile radio; radio receivers; silicon-on-insulator; 0.5 micron; 1 V; 1 to 2 GHz; 1.9 GHz; 1.93 GHz; 210 MHz; 50 ohm; CMOS digital baseband circuitry; CMOS on SOI RF/digital circuit cointegration; CMOS on SOI dual-gate mixer; CMOS technology; IF output; RF CMOS circuits; RF front-ends; RF input; Si-SiO2; capacitors; conversion gain; digital CMOS circuits; distortion; dual-gate CMOS on SOI mixer; inductors; large area circuits; minimum coupling; mixer implementations; noise figure; on-chip RF matching; power dissipation; substrate parasitics; wireless receiver front-end; Baseband; CMOS digital integrated circuits; CMOS process; CMOS technology; Costs; Coupling circuits; Gallium arsenide; Power dissipation; Radio frequency; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
SOI Conference, 2000 IEEE International
Conference_Location :
Wakefield, MA
ISSN :
1078-621X
Print_ISBN :
0-7803-6389-2
Type :
conf
DOI :
10.1109/SOI.2000.892791
Filename :
892791
Link To Document :
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