DocumentCode :
2741818
Title :
High frequency input isolation circuit for asynchronous CMOS macros in PD/SOI technology
Author :
Joshi, R.V. ; Hwang, W. ; Chuang, C.T.
Author_Institution :
IBM Res. Div., T.J. Watson Res. Center, Yorktown Heights, NY, USA
fYear :
2000
fDate :
2000
Firstpage :
140
Lastpage :
141
Abstract :
The circuit techniques presented in this paper are particularly useful for self-resetting CMOS (SRCMOS) (Henkels et al, 1999) designs in a partially depleted (PD) SOI technology, where pulse width alignment and control becomes much more difficult due to the hysteresis effect in floating body devices. Static and dynamic input isolation circuits are provided at the interface of the macro boundary in asynchronous CMOS design to render the input pulses within the specification. The technique does not require handshaking or interlock signals and is shown to improve the robustness of SRCMOS macros, especially in PD/SOI technology. The robustness of the circuit is demonstrated across a wide range of temperatures, Leffs and operating frequencies over 3 GHz with a minimum input pulse width of 0.2 ns
Keywords :
CMOS logic circuits; asynchronous circuits; circuit simulation; hysteresis; integrated circuit design; integrated circuit reliability; logic design; logic simulation; silicon-on-insulator; 0.2 ns; 2 ns; 3 GHz; PD/SOI technology; SRCMOS design; SRCMOS macro robustness; SRCMOS macros; Si-SiO2; asynchronous CMOS design; asynchronous CMOS macros; circuit techniques; dynamic input isolation circuits; effective channel length; floating body devices; high frequency input isolation circuit; hysteresis effect; input pulses; macro boundary interface; minimum input pulse width; operating frequencies; partially depleted SOI technology; pulse width alignment; pulse width control; self-resetting CMOS design; static input isolation circuits; thermal robustness; CMOS technology; Circuit simulation; Frequency; Hysteresis; Isolation technology; Isolators; Pulse circuits; Pulse generation; Space vector pulse width modulation; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
SOI Conference, 2000 IEEE International
Conference_Location :
Wakefield, MA
ISSN :
1078-621X
Print_ISBN :
0-7803-6389-2
Type :
conf
DOI :
10.1109/SOI.2000.892809
Filename :
892809
Link To Document :
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