DocumentCode
2742205
Title
A study of the structure and electrical properties of CuInSe2 /Cu-substrate
Author
Park, Soon-Yong ; Lee, Eun-Woo ; Lee, Sang-Hwan ; Park, Sang-Wook ; Han, Jae Sung ; Jeon, Chan-Wook
Author_Institution
Sch. of Display & Chem. Eng., Yeungnam Univ., Gyeongsan, South Korea
fYear
2010
fDate
20-25 June 2010
Abstract
In this study, we have formed form CuInSe2 thin film, using Cu substrate. To form thin film, we deposited on Cu substrate by evaporation and completed the element in 4 steps in total. Notably, our primary focus was on the results of deposition of In on Cu substrate, heat treatment step at low temperature for binary formation by Cu diffusion and at high temperature to convert binary phase to CuInSe2 in the end. With such results from the experiment, we are analyzed the formation of CuInSe2 thin film and the microstructure and electrical properties of the thin film. We are also tried conventional CuInSe2 thin film deposition method relying on co-evaporation and traced the cause of non-formation of CuInSe2 thin film in co-evaporation conditions. The experimental results in this study will make significant contribution to the development of various research techniques concerning flexible solar cell manufacturing processes subsequently.
Keywords
chalcogenide glasses; copper; copper compounds; crystal microstructure; diffusion; heat treatment; indium compounds; semiconductor growth; semiconductor thin films; ternary semiconductors; vacuum deposition; Cu; Cu diffusion; Cu substrate; CuInSe2; binary formation; binary phase; coevaporation conditions; conventional CuInSe2 thin film deposition method; electrical properties; flexible solar cell manufacturing processes; heat treatment step; high temperature; microstructure; structural properties; Cleaning; Copper; Gallium; Heating; Microscopy; Stress; Variable speed drives;
fLanguage
English
Publisher
ieee
Conference_Titel
Photovoltaic Specialists Conference (PVSC), 2010 35th IEEE
Conference_Location
Honolulu, HI
ISSN
0160-8371
Print_ISBN
978-1-4244-5890-5
Type
conf
DOI
10.1109/PVSC.2010.5614709
Filename
5614709
Link To Document