• DocumentCode
    2743001
  • Title

    Models of stimulation artifacts applied to integrated circuit design

  • Author

    Blum, Richard A. ; Ross, James D. ; Das, Samir K. ; Brown, Edgar A. ; DeWeerth, Stephen P.

  • Author_Institution
    Laboratory for Neuroengineering, Georgia Inst. of Technol., Atlanta, GA, USA
  • Volume
    2
  • fYear
    2004
  • fDate
    1-5 Sept. 2004
  • Firstpage
    4075
  • Lastpage
    4078
  • Abstract
    The goal of this research is to develop a monolithic stimulation and recording system capable of simultaneous, multichannel stimulation and recording. Monolithic systems are advantageous for large numbers of recording sites because they scale better than systems composed of discrete amplifiers. A major problem in recording systems is the stimulation artifact, a transient distortion present after stimulation. In order to improve recording systems, we analyze models of the stimulation artifact. Comparisons between model predictions and physical measurements verify the models. We show that the linear model, suitable for inclusion in circuit simulators, can assist in the design of an integrated recording system capable of artifact removal. The proposed design occupies 18,000 μ2 and is suitable for monolithic integration.
  • Keywords
    bioelectric potentials; integrated circuit design; microelectrodes; monolithic integrated circuits; neurophysiology; artifact removal; circuit simulators; integrated circuit design; integrated recording system; linear model; monolithic stimulation system; multielectrode arrays; neurons; stimulation artifacts; Biomembranes; Electrodes; Extracellular; Integrated circuit modeling; Integrated circuit synthesis; Laboratories; Neurons; Predictive models; Switches; Voltage; MEA; electrode; electrode models; extracellular recording; multielectrode arrrays; stimulation artifact;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society, 2004. IEMBS '04. 26th Annual International Conference of the IEEE
  • Conference_Location
    San Francisco, CA
  • Print_ISBN
    0-7803-8439-3
  • Type

    conf

  • DOI
    10.1109/IEMBS.2004.1404137
  • Filename
    1404137