DocumentCode
2743078
Title
Combining de-stressing and self repair for long-term dependable systems
Author
Koal, T. ; Vierhaus, H.T.
Author_Institution
Comput. Eng. Group, Brandenburg Univ. of Technol. Cottbus, Cottbus, Germany
fYear
2010
fDate
14-16 April 2010
Firstpage
99
Lastpage
104
Abstract
Reliability issues concerning integrated systems based on nano-electronic devices have been a matter of research for years. Early focus was on transient fault effects due to particle radiation and failing interconnects due to thermal stress and metal migration. More recently, transistor parameter deterioration due to permanent input voltages at MOS transistor gates has been investigated. One potential cure to the problem is extra circuitry that is kept in redundancy for eventual purposes of self-repair. This circuitry, however, may also be used to redistribute activities among several basic blocks for a minimization of stress effects. The paper describes an architecture that can perform de-stressing and self repair in combination and describes costs and limitations.
Keywords
MOSFET; circuit reliability; integrated circuit interconnections; life testing; minimisation; nanoelectronics; redundancy; MOS transistor gates; failing interconnects; integrated systems; long-term dependable systems; metal migration; minimization; nanoelectronic devices; particle radiation; permanent input voltages; redundancy; reliability issues; self-repair; stress effects; thermal stress; transient fault effects; transistor parameter deterioration; Circuit faults; Costs; Degradation; Integrated circuit interconnections; MOSFETs; Niobium compounds; Redundancy; Sections; Thermal stresses; Titanium compounds;
fLanguage
English
Publisher
ieee
Conference_Titel
Design and Diagnostics of Electronic Circuits and Systems (DDECS), 2010 IEEE 13th International Symposium on
Conference_Location
Vienna
Print_ISBN
978-1-4244-6612-2
Type
conf
DOI
10.1109/DDECS.2010.5491808
Filename
5491808
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