• DocumentCode
    2743078
  • Title

    Combining de-stressing and self repair for long-term dependable systems

  • Author

    Koal, T. ; Vierhaus, H.T.

  • Author_Institution
    Comput. Eng. Group, Brandenburg Univ. of Technol. Cottbus, Cottbus, Germany
  • fYear
    2010
  • fDate
    14-16 April 2010
  • Firstpage
    99
  • Lastpage
    104
  • Abstract
    Reliability issues concerning integrated systems based on nano-electronic devices have been a matter of research for years. Early focus was on transient fault effects due to particle radiation and failing interconnects due to thermal stress and metal migration. More recently, transistor parameter deterioration due to permanent input voltages at MOS transistor gates has been investigated. One potential cure to the problem is extra circuitry that is kept in redundancy for eventual purposes of self-repair. This circuitry, however, may also be used to redistribute activities among several basic blocks for a minimization of stress effects. The paper describes an architecture that can perform de-stressing and self repair in combination and describes costs and limitations.
  • Keywords
    MOSFET; circuit reliability; integrated circuit interconnections; life testing; minimisation; nanoelectronics; redundancy; MOS transistor gates; failing interconnects; integrated systems; long-term dependable systems; metal migration; minimization; nanoelectronic devices; particle radiation; permanent input voltages; redundancy; reliability issues; self-repair; stress effects; thermal stress; transient fault effects; transistor parameter deterioration; Circuit faults; Costs; Degradation; Integrated circuit interconnections; MOSFETs; Niobium compounds; Redundancy; Sections; Thermal stresses; Titanium compounds;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design and Diagnostics of Electronic Circuits and Systems (DDECS), 2010 IEEE 13th International Symposium on
  • Conference_Location
    Vienna
  • Print_ISBN
    978-1-4244-6612-2
  • Type

    conf

  • DOI
    10.1109/DDECS.2010.5491808
  • Filename
    5491808