The Reconfigurable Flip Chip Assembly System

Author

Zhou, Chen ; Yin, Yuehong ; Ding, Han

Author_Institution

Robotics Inst., Shanghai Jiao Tong Univ.

fYear

2006

fDate

7-9 June 2006

Firstpage

1

Lastpage

5

Abstract

The electronic industry developed and expanded explosively. By increasingly using flip chip (FC) packaging technology, the boundary between three levels of packaging of micro-electronic systems became indistinct. The trend towards portable and hand-held devices also enlarges the market share of FC packaging, which is the major packaging technology. Rapidly changing micro-electronic market calls for reconfigurable micro-electronic assembly systems with product variability, responsiveness, non-obsolescence, and cost-effectiveness. The introduction of FC technology and reconfigurability of assembly system are discussed in this paper, and a reconfigurable FC assembly system is presented

Keywords

flip-chip devices; integrated circuit manufacture; microassembling; packaging; flip chip packaging; microelectronic systems packaging; product variability; reconfigurable flip chip assembly system; Assembly systems; Bonding; Delay; Electronics industry; Electronics packaging; Flip chip; Manufacturing industries; Manufacturing systems; Production systems; Substrates; assembly; flip chip; reconfigurable;

fLanguage

English

Publisher

ieee

Conference_Titel

Cybernetics and Intelligent Systems, 2006 IEEE Conference on

Conference_Location

Bangkok

Print_ISBN

1-4244-0023-6

Type

conf

DOI

10.1109/ICCIS.2006.252365

Filename

4017924