Thermal Optimization of Electronic Equipment: Form Factor Improvement

The need to have equipments with a low form factor, defined as depth divided by the width multiplied by the height, is very essential for a particular product to be marketable. Thus, when an old product needs to be customized to a new form factor, while maintaining the standardized components, there will be distorted thermal distribution. In this study, original product was tested and the temperature distribution was measured. Temperature for critical components were numerically modeled and experimentally measured. The usage of ducting inside the prototype was introduced along with variable fan speed to ensure heat load meets the requirements. Numerical and experimental approach was used to verify the temperature distribution in the new prototype. The results show that, increase in duct size reduce the Nusselt number for the flow, which is detrimental to the overall heat distribution. Consequently, the fan speed needs to be increased to ensure optimum flow velocity that will conform to the accepted noise level. Final prototype was completed with form factor transform from 9 m^-1 to 1 m^-1 with more than eighty percent components maintained. The reduction in form factor shows the usage of ducting aids significantly in achieving good heat distribution. Numerical and experimental data show good agreement at all critical points measured.