The role of CAE/CAD in the avionics integrity program (AVIP)

Author

Calhoun, Phil

Author_Institution

Pacific Numerix, La Jolla, CA, USA

fYear

1988

fDate

32477

Firstpage

49

Lastpage

54

Abstract

Advances in IC technology have fueled a rapid increase in the functional density of electronic equipment. Along with this has come a higher probability of product failures caused by thermal, structural, and humidity overstressing. Most of these problems can be overcome by the proper utilization of CAE/CAD analysis software products. The author addresses these issues and discusses how design tools can help new projects meet avionics integrity program requirements

Keywords

CAD/CAM; aerospace computing; aircraft instrumentation; design engineering; electronic engineering computing; failure analysis; integrated circuit technology; reliability; thermal stresses; vibrations; AVIP; CAE/CAD; IC technology; avionics integrity program; electronic equipment; functional density; humidity overstressing; probability; product failures; structural stresses; thermal stresses; Aerospace electronics; Circuit analysis; Circuit simulation; Circuit testing; Computer aided engineering; Expert systems; Logic circuits; Packaging; Printed circuits; Thermal stresses;

fLanguage

English

Publisher

ieee

Conference_Titel

Dayton Chapter Symposium, 1988. Avionics Integrity Program., Ninth Annual IEEE/AESS

Conference_Location

Dayton, OH

Type

conf

DOI

10.1109/DAYTON.1988.76016

Filename

76016