Title :
The role of CAE/CAD in the avionics integrity program (AVIP)
Author_Institution :
Pacific Numerix, La Jolla, CA, USA
Abstract :
Advances in IC technology have fueled a rapid increase in the functional density of electronic equipment. Along with this has come a higher probability of product failures caused by thermal, structural, and humidity overstressing. Most of these problems can be overcome by the proper utilization of CAE/CAD analysis software products. The author addresses these issues and discusses how design tools can help new projects meet avionics integrity program requirements
Keywords :
CAD/CAM; aerospace computing; aircraft instrumentation; design engineering; electronic engineering computing; failure analysis; integrated circuit technology; reliability; thermal stresses; vibrations; AVIP; CAE/CAD; IC technology; avionics integrity program; electronic equipment; functional density; humidity overstressing; probability; product failures; structural stresses; thermal stresses; Aerospace electronics; Circuit analysis; Circuit simulation; Circuit testing; Computer aided engineering; Expert systems; Logic circuits; Packaging; Printed circuits; Thermal stresses;
Conference_Titel :
Dayton Chapter Symposium, 1988. Avionics Integrity Program., Ninth Annual IEEE/AESS
Conference_Location :
Dayton, OH
DOI :
10.1109/DAYTON.1988.76016
