Title :
Proceedings of International Conference on Microelectronic Test Structures
Abstract :
The following topics were dealt with: dimensional measurements; matching; interconnects and capacitance measurements; materials and device characterisation; sensors; MOSFET parameter extraction; reliability; processing
Keywords :
electric sensing devices; integrated circuit interconnections; integrated circuit measurement; integrated circuit reliability; integrated circuit testing; semiconductor device reliability; semiconductor device testing; semiconductor technology; MOSFET parameter extraction; capacitance measurements; device characterisation; dimensional measurements; interconnects; matching; materials characterisation; microelectronic test structures; processing; reliability; sensors;
Conference_Titel :
Microelectronic Test Structures, 1996. ICMTS 1996. Proceedings. 1996 IEEE International Conference on
Conference_Location :
Trento, Italy
Print_ISBN :
0-7803-2783-7
DOI :
10.1109/ICMTS.1996.535881
