• DocumentCode
    2745218
  • Title

    U-shaped Part Springback Forecasting Based on the Finite Element Method and the Neural Network

  • Author

    Jianxin, Wu ; Yang Xiaojun

  • Author_Institution
    Coll. of Mech. Eng., Inner Mongolia Univ. of Technol., Hohhot, China
  • Volume
    2
  • fYear
    2010
  • fDate
    5-6 June 2010
  • Firstpage
    253
  • Lastpage
    256
  • Abstract
    In the paper, finite element simulation parameters settings of u-shaped part bending were expounded and Dynaform was employed as simulating tool in study. Given the material parameters, orthogonal experiments in which the springback angle was the evaluating target were used, and different results under the conditions of different Blank Holding Force, Friction Coefficient, the Gap between Moulds and Radius of Moulds were given. Then an artificial neural network which can be used to train and later to predict the springback was build. The results of research shown, U-shaped part springback forecasting method basing on the neural network would be a new way of plate stamping process and mould design, and it was also having great importance to shorten mould design cycle, optimize the molding process, reduce the cost and improve the quality of stamping.
  • Keywords
    elastic deformation; finite element analysis; moulding; neural nets; plastic deformation; production engineering computing; Dynaform simulation tool; blank holding force; finite element method; friction coefficient; molding process; mould design; moulds gap; moulds radius; neural network; orthogonal experiments; plate stamping process; u-shaped part springback forecasting; Artificial neural networks; Educational institutions; Finite element methods; Friction; Mechanical engineering; Neural networks; Paper technology; Predictive models; Pressure control; Velocity control; FEM; neural network; springback;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Computing, Control and Industrial Engineering (CCIE), 2010 International Conference on
  • Conference_Location
    Wuhan
  • Print_ISBN
    978-0-7695-4026-9
  • Type

    conf

  • DOI
    10.1109/CCIE.2010.181
  • Filename
    5491951