Abstract :
The following topics are dealt with: advance electronic materials and processing, sensors, chipMOS, passive components and interconnection technology, modelling and simulation, advanced electronics packaging, and quality and reliability.
Keywords :
MOS integrated circuits; chip scale packaging; integrated circuit interconnections; integrated circuit modelling; integrated circuit reliability; passive networks; semiconductor process modelling; sensors; advance electronic materials; advanced electronics packaging; chipMOS; electronic process modelling; interconnection technology; material processing; passive components; quality; reliability; sensors;
