Title :
Welcome message from Shen-Li Fu, conference general chair
Abstract :
Presents the introductory welcome message from the conference proceedings.
Conference_Titel :
Electronic Materials and Packaging, 2008. EMAP 2008. International Conference on
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-3620-0
DOI :
10.1109/EMAP.2008.4784213
