Title :
Fluorine thermal stability of ZnO:F films investigated by thermal desorption spectroscopy
Author :
Chang, Shang-Chou ; Lin, Tien-Chai ; Li, To-Sing ; Huang, Tin-Wei
Author_Institution :
Dept. of Electr. Eng., Kun Shan Univ.
Abstract :
To estimate the fluorine thermal stability of fluorine doped zinc oxide (ZnO:F) films, ZnO:F films were prepared by co-sputtering zinc oxide(ZnO) and magnesium fluoride (MgF2) targets under different sputtering powers. The prepared films were tested with a thermal desorption system heated from room temperature to 500degC. Four elements: zinc (Zn), oxygen (O), magnesium (Mg) and fluorine (F) from ZnO:F films exhibit clear and similar thermal desorption behavior. The result indicates prepared ZnO:F films will desorb corresponding to low bound strength under 100degC heat treatment, and exhibit multilayer instead of layer by layer desorption behavior based on Polanyi-Wigner model. Fluorine is thermally unstable for ZnO:F films evidenced by thermal desorption test. Electrical and optical properties of ZnO:F films after thermal desorption test become negative. This work contributes to display or solar industry if ZnO:F films are considered to be the transparent conductive oxide films.
Keywords :
II-VI semiconductors; fluorine; heat treatment; multilayers; semiconductor doping; semiconductor thin films; sputter deposition; thermal stability; thermally stimulated desorption; wide band gap semiconductors; zinc compounds; Polanyi-Wigner model; ZnO:F; co-sputtering zinc oxide; doping; electrical properties; fluorine thermal stability; heat treatment; magnesium fluoride target; multilayers; optical properties; solar industry; sputtering powers; temperature 20 C to 500 C; thermal desorption spectroscopy; thin films; transparent conductive oxide films; Conductive films; Heat treatment; Magnesium compounds; Optical films; Spectroscopy; Sputtering; System testing; Temperature; Thermal stability; Zinc oxide; fluorine; thermal desorption; zinc oxide;
Conference_Titel :
Electronic Materials and Packaging, 2008. EMAP 2008. International Conference on
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-3620-0
Electronic_ISBN :
978-1-4244-3621-7
DOI :
10.1109/EMAP.2008.4784220