DocumentCode

2746222

Title

A pH Controlled Chemical Mechanical Polishing Method For Ultra-thin Bonded SOI Wafer

Author

Sugimoto, F. ; Horie, H. ; Arimoto, Y. ; Ito, T.

Author_Institution

Fujitsu laboratories ltd.

fYear

1993

fDate

17-19 May 1993

Firstpage

113

Lastpage

114

fLanguage

English

Publisher

ieee

Conference_Titel

VLSI Technology, 1993. Digest of Technical Papers. 1993 Symposium on

Conference_Location

Kyoto, Japan

Type

conf

DOI

10.1109/VLSIT.1993.760271

Filename

760271