مرکز منطقه ای اطلاع رساني علوم و فناوري - Planarized Silver Interconnect Technology With A Ti Self-Passivation Technique For Deep Sub-Micron ULSIs

DocumentCode :

2746309

Title :

Planarized Silver Interconnect Technology With A Ti Self-Passivation Technique For Deep Sub-Micron ULSIs

Author :

Ushiku, Y. ; Ono, H. ; Lijima, T. ; Ninomiya, N. ; Nishiyama, A. ; Twai ; Hara, H.

Author_Institution :

Toshiba Corporation

fYear :

1993

fDate :

17-19 May 1993

Firstpage :

121

Lastpage :

122

fLanguage :

English

Publisher :

ieee

Conference_Titel :

VLSI Technology, 1993. Digest of Technical Papers. 1993 Symposium on

Conference_Location :

Kyoto, Japan

Type :

conf

DOI :

10.1109/VLSIT.1993.760278

Filename :

760278

Link To Document :