• DocumentCode
    2746317
  • Title

    CVD Of Copper From A Cu+1 Precursor And Water Vapor And Formation Of TiN- Encapsulated Submicron Copper Interconnects By Chemical-Mechanical Polishing

  • Author

    Gelatos ; Poon, S. ; Marsh, R. ; Mogab, C.J. ; Thompson, M.

  • Author_Institution
    Motorola Inc.
  • fYear
    1993
  • fDate
    17-19 May 1993
  • Firstpage
    123
  • Lastpage
    124
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology, 1993. Digest of Technical Papers. 1993 Symposium on
  • Conference_Location
    Kyoto, Japan
  • Type

    conf

  • DOI
    10.1109/VLSIT.1993.760279
  • Filename
    760279
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2746317