DocumentCode :
2746358
Title :
Estimation of tibial and femoral 3D linear accelerations during gait
Author :
Turcot, K. ; Aissaoui, R. ; Pelletier, M. ; Hagemeister, N. ; Parent, G. ; de Guise, J.A.
Author_Institution :
Lab. de Recherche en Imagerie et Orthopedic, Centre de Recherche du CHUM, Montreal, Que., Canada
Volume :
2
fYear :
2004
fDate :
1-5 Sept. 2004
Firstpage :
4700
Lastpage :
4703
Abstract :
Shock wave traveling through the skeletal are more and more considered in the development of articular disorders. A method to quantify those skeletal transients is to estimate body segment linear accelerations. However, linear accelerations magnitude is influenced by many factors such as location and fixation of sensors, walking velocity, walking level and also by wearing conditions. Hence, experimental results in literature can´t be easily compared and normative data haven´t been established yet. The present paper proposes a method to estimate three-dimensional (3D) tibial and femoral linear accelerations during treadmill walking. 15 able-bodied subjects were evaluated. 3D kinematics data recorded from an optoelectronic system (Optotrak 3010, Northern Digital, Canada) at knee joint level were derived to estimated 3D linear accelerations of the tibia and the femur at their respective coordinate system origins.
Keywords :
acceleration measurement; biomedical measurement; bone; gait analysis; shock waves; 3D kinematics data; articular disorders; femoral 3D linear accelerations; gait; knee joint level; optoelectronic system; sensor fixation; sensor location; shock wave; skeletal; tibial 3D linear accelerations; treadmill walking; walking level; walking velocity; wearing conditions; Acceleration; Accelerometers; Electric shock; Joints; Kinematics; Knee; Legged locomotion; Light emitting diodes; Pathology; Shock waves; 3D linear accelerations; Gait; knee joint kinematics;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Engineering in Medicine and Biology Society, 2004. IEMBS '04. 26th Annual International Conference of the IEEE
Conference_Location :
San Francisco, CA
Print_ISBN :
0-7803-8439-3
Type :
conf
DOI :
10.1109/IEMBS.2004.1404301
Filename :
1404301
Link To Document :
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