Title :
Nanoindentation analysis of interfacial IMCs in electronic solder joints
Author :
Shen, Yu-Lin ; Song, Jenn-Ming ; Su, Chien-Wei
Author_Institution :
Dept. of Mater. Sci. & Eng., Nat. Dong Hwa Univ., Hualien
Abstract :
To evaluate the behavior of intermetallic compounds (IMCs) at different loading conditions, this study examined the hardeness and modulus of the IMCs formed at the interfaces between potential Pbfree solders (Sn-Ag-Cu and Sn-Zn) and the substrates of Cu and Ag. Compared to Ag based IMCs, Cu based IMCs are harder, stiffer, but less strain rate sensitive. It is also found that the morphology of the indent impression depends on the ratio of the modulus to hardness, and the crystal structure of the IMCs.
Keywords :
copper alloys; crystal structure; elastic moduli; hardness; indentation; silver alloys; solders; tin alloys; zinc compounds; Ag; Cu; SnAgCu; SnZn; crystal structure; electronic solder joints; hardness; interfacial intermetallic compounds; modulus; nanoindentation; strain rate; Soldering; Intermetallic compounds; Nanoindentation; Strain rate sensitivity exponent;
Conference_Titel :
Electronic Materials and Packaging, 2008. EMAP 2008. International Conference on
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-3620-0
Electronic_ISBN :
978-1-4244-3621-7
DOI :
10.1109/EMAP.2008.4784236
