Title :
Nondestructive Multilevel Interconnect Parameter Characterization For High-performance Manufacturable VLSI Technologies
Author :
Keh-Jeng Chang ; Soo-Young Oh ; Norman H.Chang ; Mui, L. ; Shiesen Peng ; Konrad Young ; Raje, P.
Author_Institution :
Hewlett-Packard Company
Conference_Titel :
VLSI Technology, 1993. Digest of Technical Papers. 1993 Symposium on
Conference_Location :
Kyoto, Japan
DOI :
10.1109/VLSIT.1993.760285
