• DocumentCode
    2746432
  • Title

    Conduction soldering: Facts, fiction and best practices

  • Author

    Wood, Paul

  • Author_Institution
    OK Int., Garden Grove, CA
  • fYear
    2008
  • fDate
    22-24 Oct. 2008
  • Firstpage
    91
  • Lastpage
    94
  • Abstract
    Manual soldering has been used for electronics assembly processes for over seven decades. Yet, even today, poor practices and poor assumptions about soldering methods still create problems with reliability and even with processing efficiencies (speed and trough-put). This paper will address the two most important elements of the soldering process, speed and control, providing essential foundational knowledge for establishing a robust soldering process. Especially in lead-lead free soldering as many companies have fallen into assuming that simply turning up the temperature will be the only solution required.
  • Keywords
    assembling; electronics packaging; soldering; conduction soldering; control; electronics assembly; lead-lead free soldering; speed; Best practices; Control systems; Copper alloys; Environmentally friendly manufacturing techniques; Heat transfer; Lead; Resistance heating; Soldering; Temperature control; Temperature sensors; 1. Understanding heat and thermal flow.; 2. Influences in tip design; 3. Understanding power and speed.; 4. Understanding tip temperature, what does it mean?;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Materials and Packaging, 2008. EMAP 2008. International Conference on
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-3620-0
  • Electronic_ISBN
    978-1-4244-3621-7
  • Type

    conf

  • DOI
    10.1109/EMAP.2008.4784237
  • Filename
    4784237