DocumentCode
2746432
Title
Conduction soldering: Facts, fiction and best practices
Author
Wood, Paul
Author_Institution
OK Int., Garden Grove, CA
fYear
2008
fDate
22-24 Oct. 2008
Firstpage
91
Lastpage
94
Abstract
Manual soldering has been used for electronics assembly processes for over seven decades. Yet, even today, poor practices and poor assumptions about soldering methods still create problems with reliability and even with processing efficiencies (speed and trough-put). This paper will address the two most important elements of the soldering process, speed and control, providing essential foundational knowledge for establishing a robust soldering process. Especially in lead-lead free soldering as many companies have fallen into assuming that simply turning up the temperature will be the only solution required.
Keywords
assembling; electronics packaging; soldering; conduction soldering; control; electronics assembly; lead-lead free soldering; speed; Best practices; Control systems; Copper alloys; Environmentally friendly manufacturing techniques; Heat transfer; Lead; Resistance heating; Soldering; Temperature control; Temperature sensors; 1. Understanding heat and thermal flow.; 2. Influences in tip design; 3. Understanding power and speed.; 4. Understanding tip temperature, what does it mean?;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Materials and Packaging, 2008. EMAP 2008. International Conference on
Conference_Location
Taipei
Print_ISBN
978-1-4244-3620-0
Electronic_ISBN
978-1-4244-3621-7
Type
conf
DOI
10.1109/EMAP.2008.4784237
Filename
4784237
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