• DocumentCode
    2746439
  • Title

    The Wave of the Future in High Density PC Converters

  • Author

    Elbanhawy, Alan

  • Author_Institution
    Fairchild Semicond., San Jose, CA
  • fYear
    2006
  • fDate
    10-14 Sept. 2006
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Recent advances in packaging and silicon design allow the design engineer to implement DC-DC converter designs breaking the current records in power density (Watt/in2) and current density (Amp/in2). We will discuss in details a recent design that boasts 400 Watt/in2 on standard 6-8 layer boards. This approach allows the design engineer to fully optimize both the electrical and PCB design as all the parasitic inductances and resistances are almost fully eliminated allowing high frequency high efficiency performance
  • Keywords
    DC-DC power convertors; current density; electronics packaging; printed circuit design; DC-DC converter design; PC converters; PCB design; current density; packaging; parasitic inductances; power density; resistances; silicon design; Buck converters; Capacitors; DC-DC power converters; Design engineering; Design optimization; Heat sinks; MOSFETs; Packaging; Power engineering and energy; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Telecommunications Energy Conference, 2006. INTELEC '06. 28th Annual International
  • Conference_Location
    Providence, RI
  • Print_ISBN
    1-4244-0430-4
  • Electronic_ISBN
    1-4244-0431-2
  • Type

    conf

  • DOI
    10.1109/INTLEC.2006.251583
  • Filename
    4018085
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2746439