DocumentCode :
2746439
Title :
The Wave of the Future in High Density PC Converters
Author :
Elbanhawy, Alan
Author_Institution :
Fairchild Semicond., San Jose, CA
fYear :
2006
fDate :
10-14 Sept. 2006
Firstpage :
1
Lastpage :
4
Abstract :
Recent advances in packaging and silicon design allow the design engineer to implement DC-DC converter designs breaking the current records in power density (Watt/in2) and current density (Amp/in2). We will discuss in details a recent design that boasts 400 Watt/in2 on standard 6-8 layer boards. This approach allows the design engineer to fully optimize both the electrical and PCB design as all the parasitic inductances and resistances are almost fully eliminated allowing high frequency high efficiency performance
Keywords :
DC-DC power convertors; current density; electronics packaging; printed circuit design; DC-DC converter design; PC converters; PCB design; current density; packaging; parasitic inductances; power density; resistances; silicon design; Buck converters; Capacitors; DC-DC power converters; Design engineering; Design optimization; Heat sinks; MOSFETs; Packaging; Power engineering and energy; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Telecommunications Energy Conference, 2006. INTELEC '06. 28th Annual International
Conference_Location :
Providence, RI
Print_ISBN :
1-4244-0430-4
Electronic_ISBN :
1-4244-0431-2
Type :
conf
DOI :
10.1109/INTLEC.2006.251583
Filename :
4018085
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=2746439
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