• DocumentCode
    2746448
  • Title

    New LTCC material with high adhesion and flexural strength

  • Author

    Ko, Minji ; Lyoo, SooHyun ; Lee, Jongmyeon ; Park, EunTae

  • Author_Institution
    Electron. Mater. & Devices Lab. (LTCC), Samsung Electro-Mech., Suwon
  • fYear
    2008
  • fDate
    22-24 Oct. 2008
  • Firstpage
    95
  • Lastpage
    97
  • Abstract
    For high reliability packaging applications, low temperature cofired ceramics (LTCC) materials are required to have a high adhesion strength and high flexural strength. To meet these demands, we designed double-layer structure to have two different degrees of crystallization between inner and surface layer. Surface layer has high degree of crystallization and another layer has low one. We controlled the amount of crystallization of each layer to make optimized values adhesion strength and flexural strength. Crystallization behavior was monitored by means of powder X-ray diffraction (XRD). The microstructure of sintered body was examined by Scanning Electron Microscopy (SEM).
  • Keywords
    X-ray diffraction; adhesion; bending strength; ceramic packaging; ceramics; crystal microstructure; crystallisation; reliability; scanning electron microscopy; LTCC material; adhesion strength; crystallization; double-layer structure; flexural strength; inner layer; low temperature co-fired ceramics materials; microstructure; powder X-ray diffraction; reliability packaging; scanning electron microscopy; surface layer; Adhesives; Ceramics; Crystalline materials; Crystallization; Materials reliability; Monitoring; Packaging; Powders; Scanning electron microscopy; Temperature;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Materials and Packaging, 2008. EMAP 2008. International Conference on
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-3620-0
  • Electronic_ISBN
    978-1-4244-3621-7
  • Type

    conf

  • DOI
    10.1109/EMAP.2008.4784238
  • Filename
    4784238