DocumentCode
2746448
Title
New LTCC material with high adhesion and flexural strength
Author
Ko, Minji ; Lyoo, SooHyun ; Lee, Jongmyeon ; Park, EunTae
Author_Institution
Electron. Mater. & Devices Lab. (LTCC), Samsung Electro-Mech., Suwon
fYear
2008
fDate
22-24 Oct. 2008
Firstpage
95
Lastpage
97
Abstract
For high reliability packaging applications, low temperature cofired ceramics (LTCC) materials are required to have a high adhesion strength and high flexural strength. To meet these demands, we designed double-layer structure to have two different degrees of crystallization between inner and surface layer. Surface layer has high degree of crystallization and another layer has low one. We controlled the amount of crystallization of each layer to make optimized values adhesion strength and flexural strength. Crystallization behavior was monitored by means of powder X-ray diffraction (XRD). The microstructure of sintered body was examined by Scanning Electron Microscopy (SEM).
Keywords
X-ray diffraction; adhesion; bending strength; ceramic packaging; ceramics; crystal microstructure; crystallisation; reliability; scanning electron microscopy; LTCC material; adhesion strength; crystallization; double-layer structure; flexural strength; inner layer; low temperature co-fired ceramics materials; microstructure; powder X-ray diffraction; reliability packaging; scanning electron microscopy; surface layer; Adhesives; Ceramics; Crystalline materials; Crystallization; Materials reliability; Monitoring; Packaging; Powders; Scanning electron microscopy; Temperature;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Materials and Packaging, 2008. EMAP 2008. International Conference on
Conference_Location
Taipei
Print_ISBN
978-1-4244-3620-0
Electronic_ISBN
978-1-4244-3621-7
Type
conf
DOI
10.1109/EMAP.2008.4784238
Filename
4784238
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