An accommodative approach designed in heat dispersion of fine-pitch Chip-On-Film packages for LCD applications

Author

Tsai, C.I. ; Liu, A.H. ; Ho, S.C. ; Liu, D.S. ; Yeh, S.S. ; Chang, Y.F.

Author_Institution

ChipMOS Technol. INC., Tainan

fYear

2008

fDate

22-24 Oct. 2008

Firstpage

98

Lastpage

101

Abstract

The reliability of Chip-On-Film (COF) packages is fundamentally dependent upon the quality of the thermal performance. The present study commences by performing an experimental investigation to establish the temperature at surface of driver IC within the COF packaging application under electric power conditions. A finite element (FE) model is then constructed to simulate the thermal behavior within the COF packaging application under equivalent power conditions. The validity of the numerical model is confirmed by comparing the simulation results with the experimental temperature measurements. The 2-metal-tape FE model was also developed based on a 1-metal-tape model to study the thermal spreading effect within the various thickness of copper lead. The results obtained from the 2-metal-tape model showed that increased thickness of copper lead can provide more efficiency to reduce the temperature at driver IC as the COF application.

Keywords

chip-on-board packaging; driver circuits; fine-pitch technology; finite element analysis; integrated circuit packaging; 1-metal-tape model; 2-metal-tape FE model; COF packaging; LCD; driver IC; fine-pitch chip-on-film packages; finite element model; heat dispersion; numerical model; reliability; thermal spreading; Application specific integrated circuits; Bonding; Copper; Finite element methods; Integrated circuit modeling; Integrated circuit packaging; Numerical models; Performance evaluation; Temperature measurement; Voltage; Chip-on-film (COF); Finite Element Analysis (FEA); Ionic migration;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Materials and Packaging, 2008. EMAP 2008. International Conference on

Conference_Location

Taipei

Print_ISBN

978-1-4244-3620-0

Electronic_ISBN

978-1-4244-3621-7

Type

conf

DOI

10.1109/EMAP.2008.4784239

Filename

4784239