Title :
Effect of piezoelectric fan height on flow and heat transfer for electronics cooling applications
Author :
Abdullah, M.K. ; Abdullah, M.Z. ; Wong, S.F. ; Khor, C.Y. ; Ooi ; Ahmad, K.A. ; Ripin, Z. Mohd ; Mujeebu, M.A.
Author_Institution :
Sch. of Mech. & Aerosp. Eng., Univ. Sains Malaysia, Nibong Tebal
Abstract :
Piezoelectric fan is used to remove the heat from the microelectronic devices, owing to their low power consumption, minimal noise emission and small in size. In the present study, a piezoelectric fan has been investigated to analyze the performance. The paper also discusses the capability of piezoelectric fan to cool the microelectronic device and its performance. The simulation and experimental investigations have been made for two different positions of piezoelectric fan i.e. vertical and horizontal positions. The Fluent 6.2.3 software which is a computational fluid dynamics (CFD) code has been used in the simulation to predict the heat transfer coefficient and the flow fields. In the experimental set-up, two heaters in line arrangement have been used in the set-up. The flow measurements have been carried out by using the particle image velocimetry (PIV) system at different piezoelectric fan height. The heat transfer coefficients have been plotted and compared with the experimental values. The simulation results obtained are found in satisfactory agreement with the experimental results.
Keywords :
computational fluid dynamics; cooling; fans; flow visualisation; piezoelectric devices; Fluent 6.2.3 software; computational fluid dynamics; electronics cooling; flow measurements; heat transfer; microelectronic device; particle image velocimetry; piezoelectric fan; Computational fluid dynamics; Computational modeling; Electronics cooling; Energy consumption; Heat transfer; Microelectronics; Particle measurements; Performance analysis; Piezoelectric devices; Predictive models;
Conference_Titel :
Electronic Materials and Packaging, 2008. EMAP 2008. International Conference on
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-3620-0
Electronic_ISBN :
978-1-4244-3621-7
DOI :
10.1109/EMAP.2008.4784255