Effect of in addition on Sn-Ag-Sb lead-free solder system

Author

Lee, Fok-Foo ; Fok-Foo Lee ; Hong, Ting-Fu ; Chen, Hsiao-Wei

Author_Institution

Dept. of Mech. Eng., Nat. Cheng Kung Univ., Tainan

fYear

2008

fDate

22-24 Oct. 2008

Firstpage

191

Lastpage

194

Abstract

The present study investigates the effect of 1~5 wt.% Indium additions on microstructure, properties and interfacial IMC´s formation of Sn-3Ag-2Sb(SAS) lead-free solder alloys. Experimental results show that addition of indium results in formation of intermetallic compounds of Ag-Sn-In phase and InSb phase. Sn atoms in Ag₃Sn compound formed originally in Sn-Ag solder system are replaced by In atoms in SAS-xIn solder system as indium content is increased. A structural and morphological transformation of Ag₃Sn to Ag₃(Sn,In), Ag₂(Sn,In) and finally to Ag₂(In,Sn) is confirmed. Meanwhile, transformation of interfacial Cu₆Sn₅ IMC layer to Cu₆(Sn,In)₅ is progressed as the level of In content is increased and accelerated by thermal storage as well.

Keywords

antimony alloys; crystal microstructure; indium alloys; interface phenomena; silver alloys; solders; solid-state phase transformations; tin alloys; Ag(SnIn); Sn-Ag-Sb; indium additions; interfacial IMC formation; intermetallic compounds; lead-free solder system; microstructure; morphological transformation; structural transformation; thermal storage; Aging; Atomic layer deposition; Environmentally friendly manufacturing techniques; Indium; Lead; Mechanical engineering; Mechanical factors; Microstructure; Optical microscopy; Temperature;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Materials and Packaging, 2008. EMAP 2008. International Conference on

Conference_Location

Taipei

Print_ISBN

978-1-4244-3620-0

Electronic_ISBN

978-1-4244-3621-7

Type

conf

DOI

10.1109/EMAP.2008.4784261

Filename

4784261