DocumentCode :
2746881
Title :
Embedded filter´s temperature effect analysis for high frequency applications
Author :
Kim, Taeeui ; Romero, Christian ; KyungO Kim ; Jung, Taesung ; Yi, Sung
Author_Institution :
Samsung Electro-Mech. Co., Ltd., Suwon
fYear :
2008
fDate :
22-24 Oct. 2008
Firstpage :
200
Lastpage :
203
Abstract :
Embedded passive technologies [1] [2] in organic substrates are still under development as an alternative miniaturization solution for highly integrated system in package (SIP) [3] with RF multi-band functionalities. There are many technical issues to be applied in real products. Characterizing the statistical variation of the substrate against the effects of temperature deviation during design is crucial therefore this paper is concerned with the temperature effect for embedded filters in organic substrates. The filter´s performance changes on temperature variation. It is one of the important issues when this technology is used in high frequency applications. A set of resonator structures is designed and fabricated as test vehicle in order to measure their scattering parameters from 1GHz up to 3GHz where the intended application is defined. Using a comparison of simulated response and measured data of the layer structure, the statistical variation of the effects of temperature provides an almost accurate representation of the embedded filter´s resonance and unloaded Q-factor.
Keywords :
Q-factor; filters; resonators; Q-factor; embedded filter; frequency 1 GHz to 3 GHz; organic substrates; resonator structures; statistical variation; temperature effect analysis; Dielectric materials; Dielectric substrates; Material properties; Organic materials; Packaging; Passive filters; Radio frequency; Temperature distribution; Temperature sensors; Vehicles;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Materials and Packaging, 2008. EMAP 2008. International Conference on
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-3620-0
Electronic_ISBN :
978-1-4244-3621-7
Type :
conf
DOI :
10.1109/EMAP.2008.4784263
Filename :
4784263
Link To Document :
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