• DocumentCode
    2746881
  • Title

    Embedded filter´s temperature effect analysis for high frequency applications

  • Author

    Kim, Taeeui ; Romero, Christian ; KyungO Kim ; Jung, Taesung ; Yi, Sung

  • Author_Institution
    Samsung Electro-Mech. Co., Ltd., Suwon
  • fYear
    2008
  • fDate
    22-24 Oct. 2008
  • Firstpage
    200
  • Lastpage
    203
  • Abstract
    Embedded passive technologies [1] [2] in organic substrates are still under development as an alternative miniaturization solution for highly integrated system in package (SIP) [3] with RF multi-band functionalities. There are many technical issues to be applied in real products. Characterizing the statistical variation of the substrate against the effects of temperature deviation during design is crucial therefore this paper is concerned with the temperature effect for embedded filters in organic substrates. The filter´s performance changes on temperature variation. It is one of the important issues when this technology is used in high frequency applications. A set of resonator structures is designed and fabricated as test vehicle in order to measure their scattering parameters from 1GHz up to 3GHz where the intended application is defined. Using a comparison of simulated response and measured data of the layer structure, the statistical variation of the effects of temperature provides an almost accurate representation of the embedded filter´s resonance and unloaded Q-factor.
  • Keywords
    Q-factor; filters; resonators; Q-factor; embedded filter; frequency 1 GHz to 3 GHz; organic substrates; resonator structures; statistical variation; temperature effect analysis; Dielectric materials; Dielectric substrates; Material properties; Organic materials; Packaging; Passive filters; Radio frequency; Temperature distribution; Temperature sensors; Vehicles;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Materials and Packaging, 2008. EMAP 2008. International Conference on
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-3620-0
  • Electronic_ISBN
    978-1-4244-3621-7
  • Type

    conf

  • DOI
    10.1109/EMAP.2008.4784263
  • Filename
    4784263