Title :
Monitoring of interface crack between solder ball and copper plate subjected to cyclic tensile loading under fluctuating temperature by direct current potential difference method
Author :
Tada, Naoya ; Ezaki, Yusuke
Author_Institution :
Grad. Sch. of Natural Sci. & Technol., Okayama Univ., Okayama
Abstract :
In this study, cyclic tension tests were carried out under fluctuating temperature condition in order to evaluate the strength of lead-free solder/copper interface. Interface crack was continuously monitored by the direct current potential difference method and the crack area ratio was successfully evaluated by the proposed method. The method could be useful not only for the in situ monitoring of cracks in interface strength tests under fluctuating temperature but also for online and on-chip monitoring of individual interface in the electric packages and various electric connections by designing similar embedded circuits.
Keywords :
condition monitoring; copper; cracks; plates (structures); solders; tensile testing; copper plate; cyclic tensile loading; cyclic tension tests; direct current potential difference method; electric connections; electric packages; embedded circuits; fluctuating temperature; interface crack; solder ball; Copper; Environmentally friendly manufacturing techniques; Heating; Lead; Monitoring; Power supplies; Resists; Soldering; Temperature; Testing;
Conference_Titel :
Electronic Materials and Packaging, 2008. EMAP 2008. International Conference on
Conference_Location :
Taipei
Print_ISBN :
978-1-4244-3620-0
Electronic_ISBN :
978-1-4244-3621-7
DOI :
10.1109/EMAP.2008.4784271
