Development of surface mount compatible reel-to-reel assembly Process of LED arrays for wide area general lighting

Author

Lee, S. W Ricky ; Tong, Y.W. ; Chan, Y.S. ; Lo, J. C C ; Zhang, R.

Author_Institution

Dept. of Mech. Eng., Hong Kong Univ. of Sci. & Technol., Hong Kong

fYear

2008

fDate

22-24 Oct. 2008

Firstpage

255

Lastpage

258

Abstract

The objective of the present study is to develop a robust high-throughput assembly process of light emitting diode arrays for wide area general lighting. Topics to be covered in this paper include the conceptual design, the flexible printed circuit substrate, flip chip assembly, yellow phosphor coating, and encapsulation. All these are integrated into one reel-to-reel assembly process. A prototype with the proposed process has been developed. A sample strip of packaged LED array has been produced as well. Recommendations for future industrial applications are also provided.

Keywords

assembling; encapsulation; flexible electronics; flip-chip devices; light emitting diodes; lighting; phosphors; printed circuits; surface mount technology; LED arrays; encapsulation; flexible printed circuit substrate; flip chip assembly; light emitting diode arrays; surface mount compatible reel-to-reel assembly; wide area general lighting; yellow phosphor coating; Assembly; Coatings; Encapsulation; Flexible printed circuits; Flip chip; LED lamps; Light emitting diodes; Optical arrays; Phosphors; Robustness;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Materials and Packaging, 2008. EMAP 2008. International Conference on

Conference_Location

Taipei

Print_ISBN

978-1-4244-3620-0

Electronic_ISBN

978-1-4244-3621-7

Type

conf

DOI

10.1109/EMAP.2008.4784277

Filename

4784277