• DocumentCode
    2747260
  • Title

    Extraction of micro-contact properties using a novel micromachined on-chip apparatus

  • Author

    Ben-Hwa Jang ; Tseng, Po-Hsun ; Fang, Weileun ; Lin, Shin-Way

  • Author_Institution
    Inst. of NEMS
  • fYear
    2008
  • fDate
    22-24 Oct. 2008
  • Firstpage
    285
  • Lastpage
    288
  • Abstract
    In this paper we first demonstrated a micromachined device consisting of two chips to characterize the micro-contact properties, such as contact force, film resistance, constriction resistance, and contact surface roughness. Then, based on our unique circuit routing enabling parasitic resistance on chips to be eliminated, the film thickness, the effective contact area radius, and the Ohmic resistance and Sharvin resistance can be further analyzed. In addition, the two chips of the testing device can be disassembled and re-assembled, the interfacial properties can be therefore quantified at different contact cycles (N). Thus, both the qualitative and quantitative relationship among the interfacial properties can be investigated. To demonstrate the feasibility of the present apparatus, the contact characteristics of evaporated Al films were characterized. Potential applications of the present apparatus included a diagnostic tool for tribology and the performance enhancement for RF-MEMS switches and microconnectors.
  • Keywords
    aluminium; contact resistance; micromechanical devices; ohmic contacts; surface roughness; vacuum deposition; Al; Ohmic resistance; RF-MEMS switches; Sharvin resistance; constriction resistance; contact force; contact surface roughness; diagnostic tool; evaporated films; film resistance; film thickness; interfacial property; microconnectors; microcontact; micromachined on-chip apparatus; parasitic resistance; tribology; unique circuit routing; Circuit testing; Contact resistance; Radiofrequency microelectromechanical systems; Rough surfaces; Routing; Surface resistance; Surface roughness; Switches; Thick film circuits; Tribology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Materials and Packaging, 2008. EMAP 2008. International Conference on
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-3620-0
  • Electronic_ISBN
    978-1-4244-3621-7
  • Type

    conf

  • DOI
    10.1109/EMAP.2008.4784284
  • Filename
    4784284