DocumentCode
2747415
Title
Tolerance analysis for embedded passive in organic substrate
Author
Kim, Taeeui ; Kim, KyungO ; Kim, IIongwon ; Jung, Taesung ; Yi, Sung
Author_Institution
Samsung Electro-Mech. Co. Ltd., Suwon, South Korea
fYear
2008
fDate
22-24 Oct. 2008
Firstpage
317
Lastpage
320
Abstract
This paper focuses on design issues brought by tolerance drifts of organic embedded passive technology and their potential effects in RF system applications. The embedded passive technology provides advantage in small form factor for RF modules which are very suitable for miniaturization with promising high level of integration however due to some factors both in the material properties and fabrication processes, their unstable performance especially at high RF is seen as a challenge. Applications operating at high frequency ranges from 1 GHz up to over 5 GHz where at system level there is a critical need for very tight tolerance because of the short wavelength and small geometric dimension. The factors that significantly affect the tolerance are analyzed in this study. Some factors are discussed with measurement data along with validation using simulation tools. This study suggests main issues that should be considered during product development using organic embedded passive technology.
Keywords
electron device testing; electronics packaging; RF modules; RF system; embedded passive device; fabrication; form factor; miniaturization; organic substrate; tolerance analysis; Costs; Fabrication; Material properties; Microwave technology; Product development; Radio frequency; Substrates; Testing; Tolerance analysis; Wavelength measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Materials and Packaging, 2008. EMAP 2008. International Conference on
Conference_Location
Taipei
Print_ISBN
978-1-4244-3620-0
Electronic_ISBN
978-1-4244-3621-7
Type
conf
DOI
10.1109/EMAP.2008.4784292
Filename
4784292
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