• DocumentCode
    2747415
  • Title

    Tolerance analysis for embedded passive in organic substrate

  • Author

    Kim, Taeeui ; Kim, KyungO ; Kim, IIongwon ; Jung, Taesung ; Yi, Sung

  • Author_Institution
    Samsung Electro-Mech. Co. Ltd., Suwon, South Korea
  • fYear
    2008
  • fDate
    22-24 Oct. 2008
  • Firstpage
    317
  • Lastpage
    320
  • Abstract
    This paper focuses on design issues brought by tolerance drifts of organic embedded passive technology and their potential effects in RF system applications. The embedded passive technology provides advantage in small form factor for RF modules which are very suitable for miniaturization with promising high level of integration however due to some factors both in the material properties and fabrication processes, their unstable performance especially at high RF is seen as a challenge. Applications operating at high frequency ranges from 1 GHz up to over 5 GHz where at system level there is a critical need for very tight tolerance because of the short wavelength and small geometric dimension. The factors that significantly affect the tolerance are analyzed in this study. Some factors are discussed with measurement data along with validation using simulation tools. This study suggests main issues that should be considered during product development using organic embedded passive technology.
  • Keywords
    electron device testing; electronics packaging; RF modules; RF system; embedded passive device; fabrication; form factor; miniaturization; organic substrate; tolerance analysis; Costs; Fabrication; Material properties; Microwave technology; Product development; Radio frequency; Substrates; Testing; Tolerance analysis; Wavelength measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Materials and Packaging, 2008. EMAP 2008. International Conference on
  • Conference_Location
    Taipei
  • Print_ISBN
    978-1-4244-3620-0
  • Electronic_ISBN
    978-1-4244-3621-7
  • Type

    conf

  • DOI
    10.1109/EMAP.2008.4784292
  • Filename
    4784292