DocumentCode
2747435
Title
Finite element simulation of SMFBAR based sensor
Author
Cheng, Chi-Jung ; Atashbar, Massood Zandi
Author_Institution
Dept. of Electr. & Comput. Eng., Western Michigan Univ., Kalamazoo, MI, USA
fYear
2009
fDate
7-9 June 2009
Firstpage
190
Lastpage
195
Abstract
In this work, a three dimensional finite element model for solidly mounted film bulk acoustic resonator (SMFBAR) devices is developed and simulated. The simulation is performed using the CoventorWareTM platform to analyze the performance of the device. The influence of the shape of the top electrode and its thickness on the sensitivity SMFBAR based sensors was investigated. Two different electrode shapes (square and circle) with surface areas of 0.04 mm2 and 0.09 mm2 and different thicknesses varying from 50 nm to 350 nm with increments of 100 nm were investigated. The devices that were studied were ZnO based SMFBAR structures. The analysis revealed that both configurations have mass sensitivities with three orders of magnitude higher than that of quartz crystal microbalance sensing systems. These devices also exhibit high performance with maximum quality factor of 418 and effective electromechanical coupling coefficient of around 12.2%. Also, it was found out that the circular shaped top electrodes performance were slightly higher than that of square shaped one with respect to sensitivity, quality factor and effective electromechanical coupling.
Keywords
acoustic resonators; finite element analysis; sensors; electrodes; electromechanical coupling coefficient; finite element simulation; quartz crystal microbalance sensing systems; solidly mounted film bulk acoustic resonator; Acoustic sensors; Analytical models; Electrodes; Film bulk acoustic resonators; Finite element methods; Performance analysis; Q factor; Shape; Solid modeling; Zinc oxide;
fLanguage
English
Publisher
ieee
Conference_Titel
Electro/Information Technology, 2009. eit '09. IEEE International Conference on
Conference_Location
Windsor, ON
Print_ISBN
978-1-4244-3354-4
Electronic_ISBN
978-1-4244-3355-1
Type
conf
DOI
10.1109/EIT.2009.5189609
Filename
5189609
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