• DocumentCode
    2747597
  • Title

    Energy-delay analysis for on-chip interconnect at the system level

  • Author

    Zhang, Yan ; Irwin, Mary Jane

  • Author_Institution
    Dept. of Comput. Sci. & Eng., Pennsylvania State Univ., University Park, PA, USA
  • fYear
    1999
  • fDate
    1999
  • Firstpage
    26
  • Lastpage
    31
  • Abstract
    Given today´s deep submicron technologies, increasing clock rates, and ever-larger die sizes, interconnect plays an increasing role in determining the total chip area, delay, and power consumption. Thus, interconnects must be accounted for as early as possible during the design process. This paper presents a system level interconnect power and delay modeling method and applies it to a commercial chip that integrates a 16-bit DSP and a 32-bit RISC microcontroller. An architectural level simulator for the commercial chip has been enhanced to generate the bus activities for a set of signal processing benchmarks and some synthetic benchmarks. The power delay and energy-delay measurements for all six top level buses of the chip are reported
  • Keywords
    circuit simulation; delay estimation; digital integrated circuits; integrated circuit interconnections; integrated circuit modelling; architectural level simulator; bus activities; commercial chip; energy-delay analysis; interconnect delay modeling; interconnect power modeling; on-chip interconnect; signal processing benchmarks; system level modelling; Clocks; Delay; Digital signal processing chips; Energy consumption; Microcontrollers; Power system interconnection; Power system modeling; Process design; Reduced instruction set computing; System-on-a-chip;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI '99. Proceedings. IEEE Computer Society Workshop On
  • Conference_Location
    Orlando, FL
  • Print_ISBN
    0-7695-0152-4
  • Type

    conf

  • DOI
    10.1109/IWV.1999.760465
  • Filename
    760465