DocumentCode
2748103
Title
Process monitoring techniques using acoustic waves
Author
Bhardwaj, Sanjay ; Khuri-Yakub, B.T. ; Saraswat, K.C.
Author_Institution
Stanford Univ., CA, USA
fYear
1990
fDate
4-7 Dec 1990
Firstpage
367
Abstract
The authors outline the limitations of current film thickness technology and propose two novel methods for nondestructive, in-situ film thickness process monitoring: acoustic time domain reflectometry (TDR) and acoustic reflection coefficient phase measurements. Theoretical calculations and experimental measurements of different metal films are used to demonstrate the viability of these techniques. An experimental system has been built and preliminary results on gold films show promise for using acoustic TDR as a postdeposition process monitor. An experimental system based on acoustic reflection coefficient phase measurements has been built and shows good preliminary results in gold and aluminum films
Keywords
metallisation; process control; thickness measurement; time-domain reflectometry; ultrasonic applications; ultrasonic materials testing; ultrasonic reflection; Al films; Au films; acoustic reflection coefficient phase measurements; acoustic time domain reflectometry; in-situ film thickness process monitoring; metal films; nondestructive monitoring; postdeposition process monitor; Acoustic measurements; Acoustic pulses; Acoustic waves; Fabrication; Instruments; Monitoring; Optical films; Phase measurement; Semiconductor films; Thickness measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium, 1990. Proceedings., IEEE 1990
Conference_Location
Honolulu, HI
Type
conf
DOI
10.1109/ULTSYM.1990.171388
Filename
171388
Link To Document