• DocumentCode
    2748103
  • Title

    Process monitoring techniques using acoustic waves

  • Author

    Bhardwaj, Sanjay ; Khuri-Yakub, B.T. ; Saraswat, K.C.

  • Author_Institution
    Stanford Univ., CA, USA
  • fYear
    1990
  • fDate
    4-7 Dec 1990
  • Firstpage
    367
  • Abstract
    The authors outline the limitations of current film thickness technology and propose two novel methods for nondestructive, in-situ film thickness process monitoring: acoustic time domain reflectometry (TDR) and acoustic reflection coefficient phase measurements. Theoretical calculations and experimental measurements of different metal films are used to demonstrate the viability of these techniques. An experimental system has been built and preliminary results on gold films show promise for using acoustic TDR as a postdeposition process monitor. An experimental system based on acoustic reflection coefficient phase measurements has been built and shows good preliminary results in gold and aluminum films
  • Keywords
    metallisation; process control; thickness measurement; time-domain reflectometry; ultrasonic applications; ultrasonic materials testing; ultrasonic reflection; Al films; Au films; acoustic reflection coefficient phase measurements; acoustic time domain reflectometry; in-situ film thickness process monitoring; metal films; nondestructive monitoring; postdeposition process monitor; Acoustic measurements; Acoustic pulses; Acoustic waves; Fabrication; Instruments; Monitoring; Optical films; Phase measurement; Semiconductor films; Thickness measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium, 1990. Proceedings., IEEE 1990
  • Conference_Location
    Honolulu, HI
  • Type

    conf

  • DOI
    10.1109/ULTSYM.1990.171388
  • Filename
    171388