DocumentCode
2748194
Title
Design and realization of an accurate built-in current sensor for on-line power dissipation measurement and IDDQ testing
Author
Arabi, Karim ; Kaminska, Bozena
Author_Institution
Opmaxx Inc., Beaverton, OR, USA
fYear
1997
fDate
1-6 Nov 1997
Firstpage
578
Lastpage
586
Abstract
Built-in current sensor (BICS) is known to enhance test accuracy, defect coverage and test rate of quiescent current (IDDQ) testing method in CMOS VLSI circuits. For new deep-submicron technologies, BICSs become essential for accurate and practical IDDQ testing. This paper presents a new BICS suitable for on-line power dissipation measurement and IDDQ testing. Although the BICS presented in this paper is dedicated to submicron technologies that require reduced supply voltage, it can also be used for applications and technologies requiring normal supply voltage. The proposed BICS has been extended for on-line measurement of the power dissipation using only an additional capacitor. Power dissipation measurement is important for safety-critical applications and battery-powered systems. A simple self-test approach to verify the functionality and accuracy of BICSs has also been introduced. The proposed BICS has been implemented and tested using an N-well CMOS 1.2 μm technology. Practical results demonstrate that a very good measurement accuracy can be achieved
Keywords
CMOS integrated circuits; VLSI; application specific integrated circuits; built-in self test; digital integrated circuits; electric sensing devices; integrated circuit testing; power measurement; 1.2 micron; BICS; CMOS VLSI circuits; IDDQ testing; battery-powered systems; built-in current sensor; deep-submicron technologies; defect coverage; power dissipation measurement; quiescent current testing method; safety-critical applications; submicron technologies; test accuracy; test rate; Application specific integrated circuits; CMOS technology; Circuit testing; Current measurement; Fabrication; Logic testing; Pins; Power dissipation; Power measurement; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Test Conference, 1997. Proceedings., International
Conference_Location
Washington, DC
ISSN
1089-3539
Print_ISBN
0-7803-4209-7
Type
conf
DOI
10.1109/TEST.1997.639666
Filename
639666
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