• DocumentCode
    2748194
  • Title

    Design and realization of an accurate built-in current sensor for on-line power dissipation measurement and IDDQ testing

  • Author

    Arabi, Karim ; Kaminska, Bozena

  • Author_Institution
    Opmaxx Inc., Beaverton, OR, USA
  • fYear
    1997
  • fDate
    1-6 Nov 1997
  • Firstpage
    578
  • Lastpage
    586
  • Abstract
    Built-in current sensor (BICS) is known to enhance test accuracy, defect coverage and test rate of quiescent current (IDDQ) testing method in CMOS VLSI circuits. For new deep-submicron technologies, BICSs become essential for accurate and practical IDDQ testing. This paper presents a new BICS suitable for on-line power dissipation measurement and IDDQ testing. Although the BICS presented in this paper is dedicated to submicron technologies that require reduced supply voltage, it can also be used for applications and technologies requiring normal supply voltage. The proposed BICS has been extended for on-line measurement of the power dissipation using only an additional capacitor. Power dissipation measurement is important for safety-critical applications and battery-powered systems. A simple self-test approach to verify the functionality and accuracy of BICSs has also been introduced. The proposed BICS has been implemented and tested using an N-well CMOS 1.2 μm technology. Practical results demonstrate that a very good measurement accuracy can be achieved
  • Keywords
    CMOS integrated circuits; VLSI; application specific integrated circuits; built-in self test; digital integrated circuits; electric sensing devices; integrated circuit testing; power measurement; 1.2 micron; BICS; CMOS VLSI circuits; IDDQ testing; battery-powered systems; built-in current sensor; deep-submicron technologies; defect coverage; power dissipation measurement; quiescent current testing method; safety-critical applications; submicron technologies; test accuracy; test rate; Application specific integrated circuits; CMOS technology; Circuit testing; Current measurement; Fabrication; Logic testing; Pins; Power dissipation; Power measurement; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Test Conference, 1997. Proceedings., International
  • Conference_Location
    Washington, DC
  • ISSN
    1089-3539
  • Print_ISBN
    0-7803-4209-7
  • Type

    conf

  • DOI
    10.1109/TEST.1997.639666
  • Filename
    639666