• DocumentCode
    2748857
  • Title

    Critical study of the Vertical-Cavity Surface Emitting Lasers (VCSEL) electrical access for integrated optical sub-assembly

  • Author

    Rissons, Angélique ; Mollier, Jean-Claude

  • Author_Institution
    DEOS, Univ. de Toulouse, Toulouse, France
  • fYear
    2009
  • fDate
    11-12 June 2009
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The proposal contribution aims at highlighting the consequence of the impedance mismatching in VCSEL-based optical subassembly for optical interconnection applications. The integration of this micro-laser diode to an optical interconnection module needs a particular care to avoid electromagnetic coupling which could transform the advantage of the VCSEL technology in a weakness. Indeed, the vertical emission perpendicular to the active layer gives the possibility to achieve the need of planarization of the optoelectronic circuits and the design of VCSEL arrays. That is why it is of great interest to develop an optoelectronic model including the electrical access effect. This model is based on the VCSEL rate equation comparison with a behavioral small-signal equivalent circuit. Scattering parameters of various VCSEL structures and various VCSEL chip submounts are tested. This characterization allows the validation of the laser model and emphasizes the influence of the electrical access during the light transmission. In a particular VCSEL array structure, a crosstalk phenomenon is also observed. This crosstalk increases strongly with increase in the frequency. Consequently the electrical access to the VCSEL needs to be improved in order to avoid an inadequate utilization of the VCSEL.
  • Keywords
    equivalent circuits; impedance matching; integrated optoelectronics; micro-optics; optical crosstalk; optical interconnections; semiconductor laser arrays; surface emitting lasers; VCSEL arrays; VCSEL electrical access; behavioral small-signal equivalent circuit; crosstalk phenomenon; electromagnetic coupling; impedance mismatching; integrated optical sub-assembly; light transmission; microlaser diode; optical interconnection module; optoelectronic circuits; planarization; vertical emission; vertical-cavity surface emitting laser; Integrated optics; Optical crosstalk; Optical interconnections; Optical scattering; Proposals; Semiconductor device modeling; Stimulated emission; Surface emitting lasers; Surface impedance; Vertical cavity surface emitting lasers; Optical Interconnection; Optoelectronic S-Parameters; VCSEL; crosstalk; small-signal equivalent circuit;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electromagnetic Compatibility - EMC Europe, 2009 International Symposium on
  • Conference_Location
    Athens
  • Print_ISBN
    978-1-4244-4107-5
  • Electronic_ISBN
    978-1-4244-4108-2
  • Type

    conf

  • DOI
    10.1109/EMCEUROPE.2009.5189686
  • Filename
    5189686