DocumentCode
2749149
Title
Fundamental mechanisms of coupling between planar electromagnetic bandgap structures and interconnects in high-speed digital circuits. Part I - microstrip lines
Author
De Paulis, F. ; Orlandi, A. ; Raimondo, L. ; Antonini, G.
Author_Institution
UAq EMC Lab., Univ. of L´´Aquila, L´´Aquila, Italy
fYear
2009
fDate
11-12 June 2009
Firstpage
1
Lastpage
4
Abstract
The paper studies the signal integrity performances of a microstripline routed over a planar EBG structure. The fundamental mechanisms of the coupling between the signal transmitted along the trace and the resonant properties of the same structure are investigated.
Keywords
digital circuits; high-speed integrated circuits; integrated circuit interconnections; microstrip lines; photonic band gap; EBG structure; fundamental mechanisms; high-speed digital circuits; microstrip lines; planar electromagnetic bandgap structures; signal transmission; Coupling circuits; Digital circuits; Electromagnetic coupling; Frequency; Integrated circuit interconnections; Integrated circuit noise; Metamaterials; Microstrip components; Periodic structures; Resonance; PDN; cavity resonances; planar EBG; power integrity; signal integrity;
fLanguage
English
Publisher
ieee
Conference_Titel
Electromagnetic Compatibility - EMC Europe, 2009 International Symposium on
Conference_Location
Athens
Print_ISBN
978-1-4244-4107-5
Electronic_ISBN
978-1-4244-4108-2
Type
conf
DOI
10.1109/EMCEUROPE.2009.5189701
Filename
5189701
Link To Document