Thermal tests and analyses of potted leadless chip carriers

Author

Boughton, B.D. ; Schutt, J.A.

Author_Institution

Sandia Nat. Lab., Albuquerque, NM, USA

fYear

1989

fDate

7-9 Feb. 1989

Firstpage

19

Abstract

Summary form only given. A numerical and experimental study has been conducted to evaluate the thermal performance of leadless ceramic chip carrier packages used in hybrid microcircuit applications at Sandia National Laboratories. This was undertaken to develop a modeling technique which can be used for evaluating the steady-state and transient performance of future hybrid microcircuit designs and to investigate the effect of various packaging parameters. A finite-element model of a 40-pad leadless ceramic chip carrier package was developed and tests were conducted to benchmark the model prediction capability. Sufficient detail was included in the model to capture the solder joints between the chip carrier and the alumina substrate. Steady-state tests were performed with a specially designed chip in order to make direct measurements of the chip surface temperature. The steady-state analysis results were in agreement with the test measurements.<>

Keywords

hybrid integrated circuits; integrated circuit technology; packaging; temperature measurement; transients; Al/sub 2/O/sub 3/; alumina substrate; benchmark; chip surface temperature; finite-element model; hybrid microcircuit; leadless ceramic chip carrier packages; modeling; potted leadless chip carriers; solder joints; steady state performance; temperature measurement; tests; thermal performance; transient performance; Ceramics; Hybrid integrated circuits; Laboratories; Lead; Packaging; Predictive models; Semiconductor device measurement; Steady-state; Testing; Thermal conductivity;

fLanguage

English

Publisher

ieee

Conference_Titel

Semiconductor Thermal and Temperature Measurement Symposium, 1989. SEMI-THERM V., Fifth Annual IEEE

Conference_Location

San Diego, CA, USA

Type

conf

DOI

10.1109/STHERM.1989.76059

Filename

76059